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IC Substrate Multilayer Rigid PCB MEMS Sensor Micro Electromechanical System

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IC Substrate Multilayer Rigid PCB MEMS Sensor Micro Electromechanical System

Brand Name : TECircuit

Model Number : TEC0208

Certification : UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W

Place of Origin : China

MOQ : 1pcs

Price : USD 1.99 ~ USD9.99/pcs

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 50000 pcs/month

Delivery Time : 5-15 wotk days

Packaging Details : Vacuum package+Carton box

Brand : Shenzhen Tecircuit Electronics Co., Ltd

Product Type : PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core

Item No. : R0076

Service : PCBA service

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Product Images

IC Substrate Multilayer Rigid PCB MEMS Sensor Micro Electromechanical System

About TECircuit

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

Product Applications

  • Consumer Electronics:

    • Used in smartphones and tablets for motion sensing, orientation detection, and environmental sensing (temperature, humidity).

  • Automotive Systems:

    • Integrated into vehicles for applications such as airbag deployment sensors, tire pressure monitoring systems (TPMS), and stability control.

  • Medical Devices:

    • Employed in diagnostic and monitoring equipment, including wearable health devices that track vital signs and movements.

  • Industrial Automation:

    • Used in factory automation systems for pressure, temperature, and motion monitoring to enhance operational efficiency.

  • Smart Home Devices:

    • Integrated into smart appliances for environmental monitoring, security systems, and energy management.

  • Robotics:

    • Employed in robotic systems for navigation, positioning, and environmental interaction through various sensors.

  • Aerospace and Defense:

    • Used in inertial measurement units (IMUs) for navigation and guidance systems, ensuring precision in critical applications.

  • Gaming and Virtual Reality:

    • Integrated into gaming controllers and VR headsets for motion tracking and immersive experiences.

  • Environmental Monitoring:

    • Used in sensors that detect air quality, pollution levels, and other environmental parameters.

  • Agriculture:

    • Employed in precision agriculture for monitoring soil conditions, crop health, and environmental factors affecting yield.

Product Features

  1. Miniaturization:

    • MEMS sensors are compact, allowing for integration into small devices without sacrificing performance.

  2. High Sensitivity:

    • Designed to detect minute changes in physical phenomena, providing accurate readings for various applications.

  3. Low Power Consumption:

    • Engineered for energy efficiency, making them suitable for battery-operated and portable devices.

  4. Robustness:

    • Built to withstand harsh environmental conditions, ensuring reliability in various applications, including automotive and industrial settings.

  5. High Precision and Accuracy:

    • Offers reliable measurements with low drift and high repeatability, essential for critical applications.

  6. Integration Capability:

    • Can be easily integrated with other electronic components, enhancing functionality in complex systems.

  7. Cost-Effectiveness:

    • Mass production techniques for MEMS devices reduce costs, making them accessible for a wide range of applications.

  8. Versatility:

    • MEMS sensors can be designed for various sensing modalities, including acceleration, pressure, temperature, and chemical detection.

  9. Real-Time Data Processing:

    • Capable of providing immediate feedback and data, essential for applications requiring real-time monitoring and control.

  10. Compliance with Industry Standards:

    • Manufactured to meet stringent safety and performance standards, ensuring reliability in critical applications.

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers: 1-42layers
PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size: 620mm*1100mm
PCB certificate: RoHS Directive-Compliant
PCB Thickness: 1.6 ±0.1mm
Out Layer Copper Thickness: 0.5-5oz
Inner Layer Copper Thickness: 0.5-4oz
PCB max. board thickness: 6.0mm
Minimum Hole Size: 0.20mm
Minimum Line Width/Space: 3/3mil
Min. S/M Pitch: 0.1mm(4mil)
Plate Thickness and Aperture Ratio : 30:1
Minimum Hole Copper: 20µm
Hole Dia. Tolerance(PTH): ±0.075mm(3mil)
Hole dia. Tolerance(NPTH): ±0.05mm (2mil)
Hole Position Deviation: ±0.05mm (2mil)
Outline Tolerance: ±0.05mm (2mil)
PCB solder mask: Black, white, yellow
PCB surface finished: HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend: White
E-test: 100% AOI, X-ray, Flying probe test.
Outline: Rout and Score/V-cut
Inspection Standard: IPC-A-610CCLASSII
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports: Final Inspection, E-test, Solderability Test, Micro Section and More

Product Tags:

IC Substrate Multilayer Rigid PCB

      

Electromechanical System Rigid PCB

      
Quality IC Substrate Multilayer Rigid PCB MEMS Sensor Micro Electromechanical System wholesale

IC Substrate Multilayer Rigid PCB MEMS Sensor Micro Electromechanical System Images

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